Laminates
for printed circuit

FENOLITE

Kraft paper and phenolic resin based coppered laminate used in the manufacturing of conventionally printed circuit boards.

Application:

Segments of the electronics industry, nod circuit boards are specified

impressos XPC, FR1 ou FR2, simples ou dupla face.

Reference standards:

ANSI/NEMA:XPC / JIS: PP7 (UL94 HB)

ANSI/NEMA:FR-1 / JIS:PP7F (UL94 V-0)

ANSI/NEMA:FR-2 / JIS PP3F (UL94 V-0)

Complies with Standard: RoHS Compliant

FIBERGLASS

Glass fiber and epoxy resin based coppered laminate used in the manufacturing of conventional and professional printed circuit boards.

Application:

Segments of the electronics industry where FR4 printed circuit boards are specified, single,

double-sided or multilayer.

Reference standards:

ANSI/NEMA:FR-4 (UL94 V-0)

Complies with Standard: RoHS Compliant

COMPOSITE

Glass fiber, kraft paper and epoxy resin based coppered laminate used in the

manufacturing of conventional printed circuit boards.

Application:

Segments of the electronics industry, nod circuit boards are specified

impressos CEM-1, simples ou dupla face.

Reference standards:

ANSI/NEMA:CEM-1 (UL94 V-0)

Complies with Standard: RoHS Compliant

METAL CORE

Glass fiber, epoxy resin based coppered laminate with aluminum support used in the

manufacturing of circuit boards printed with LED technology (high intensity).

Application:

Segments of the electronics industry where METAL CORE printed circuit boards are specified, single, double-sided or multilayer with aluminum support for dissipation of heat of

up to 3.0W/mK.

Reference Standards:

IPC-4101C Spec/21 (UL94 V-0) – Test Method: ASTM D5470 e IPC-TM- 650

Complies with Standard: RoHS Compliant

PREPREG

Prepreg’s basic composition consists of Glass fiber with high grade epoxy resin.

Application:

Segments of the electronics industry, specifically in the production of multilayered printed

circuit boards.

Reference standards:

ANSI/NEMA:FR-4 (UL94 V-0)

Complies with Standard: RoHS Compliant

ELECTROLYTE COPPER

18μm; 35μm or 70μm non-adhesive roles of electrolyte copper.

Aplicação:

Segments of the electronics industry in the production of multilayered printed circuit boards

Reference standards:

IPC-4562A – Test Method: IPC-TM- 650

Complies with Standard: RoHS Compliant